Plasma display apparatus

ABSTRACT

A plasma display apparatus includes: a plasma display panel; a chassis base arranged parallel to the plasma display panel; a driver IC electrically connecting electrodes of the plasma display panel to a driving circuit, the driver IC adapted to supply voltage signals to the electrodes of the plasma display panel in accordance with signals from the driving circuit; and a heat dissipating plate arranged adjacent to the driver IC and facing the chassis base to interpose the driver IC between the chassis base and a heat dissipating plate; wherein the heat dissipating plate includes an accommodating portion adapted to accommodate the driver IC on a side surface thereof opposite to the driver IC.

CLAIM OF PRIORITY

This application makes reference to, incorporates the same herein, andclaims all benefits accruing under 35 U.S.C. §119 from applicationsentitled PLASMA DISPLAY APPARATUS filed earlier with the KoreanIntellectual Property Office on 23 Oct. 2003 and 4 Mar. 2004 and thereduly assigned Serial Nos. 2003-74276 and 2004-14564, respectively.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a plasma display apparatus, and, moreparticularly, to a plasma display apparatus that includes a heatdissipating plate to efficiently transfer heat produced by a driver IC.

2. Description of the Related Art

Generally, a plasma display apparatus has a plasma display panel fordisplaying the desired images with a plasma generated by a gasdischarge. The plasma display panel has electrodes that are electricallyconnected to a driving circuit, and a driver IC supplies voltage signalsto the electrodes in accordance with signals outputted by the drivingcircuit.

Voltage application structures using a driver IC include a Chip-On-Board(COB) structure where the driver IC is mounted on a Printed CircuitBoard (PCB), and a Chip-On-Film (COF) structure where the driver IC isdirectly mounted on a Flexible Printed Circuit (FPC) film. A small-sizedand low cost Tape Carrier Package (TCP) is now being extensively used asa voltage application structure.

In order to express at least a 256 gray scale with a plasma displaypanel, at least eight-timed address discharges must occur during 1/60 ofa second corresponding to one TV field, and hence, a considerable amountof heat is generated by the COF, the COB, or the TCP mounted on thechassis base.

Accordingly, a reinforcing plate is provided with the COB or the COF toreinforce its structural intensity integrity and fix it to the chassisbase. The reinforcing plate further has a role of a heat sink todissipate the heat generated by the IC to the outside.

A heat sink is used in order to dissipate the heat produced by the TCPdriver IC. The heat sink that is used can be a solid heat dissipatingsheet attached to the TCP to dissipate the heat into the air. However,such a heat sink has the low heat dissipation efficiency. Therefore,there is a problem in that the heat sink must be large relative to thesize of the driver IC to dissipate the large amount of heat generated bythe TCP driver IC.

SUMMARY OF THE INVENTION

It is an object of the present invention to provide a plasma displayapparatus which has a heat dissipating structure for a driver IC that iscapable of enhancing the reliability of the driver IC in that itefficiently dissipates the heat produced by the driver IC to prevent abreakdown or other malfunction from occurring.

A plasma display apparatus according to one aspect of the presentinvention comprises: a plasma display panel; a chassis base arrangedparallel to the plasma display panel; a driver IC electricallyconnecting electrodes of the plasma display panel to a driving circuit,the driver IC adapted to supply voltage signals to the electrodes of theplasma display panel in accordance with signals from the drivingcircuit; and a heat dissipating plate arranged adjacent to the driver ICand facing the chassis base to interpose the driver IC between thechassis base and a heat dissipating plate; wherein the heat dissipatingplate includes an accommodating portion adapted to accommodate thedriver IC on a side surface thereof opposite to the driver IC.

The accommodating portion preferably comprises a thermal conductionmedium.

A thermal conduction medium is preferably interposed between the driverIC and a side surface of the heat dissipating plate opposite thereto.

The thermal conduction medium is preferably interposed between theaccommodating portion of the heat dissipating plate and a side surfaceof the driver IC opposite thereto.

The accommodating portion of the thermal conduction medium is preferablyfilled with a thermally conductive liquid or gel medium.

The thermal conduction medium is preferably a silicone oil or a thermalgrease.

The accommodating portion preferably includes an accommodating recessconcavely formed on a side surface of the heat dissipating plate.

The accommodating portion preferably includes a projecting portionformed on another side surface thereof and corresponding to theaccommodating recess.

A plurality of heat dissipating fins are preferably arranged integrallyon another side surface of the heat dissipating plate.

A heat sink is preferably mounted on another side surface of the heatdissipating plate, the heat sink having a plurality of heat dissipatingfins.

The heat dissipating plate preferably comprises: a first portionarranged in parallel with the chassis base so as to be opposed to thedriver IC; and a second portion extending integrally from one distal endof the first portion toward a peripheral edge of the plasma displaypanel.

The driver IC is preferably electrically connected to electrodes of theplasma display panel via a Flexible Printed Circuit (FPC) and is whollysurrounded by the accommodating portion and wherein the accommodatingportion is penetrated by the FPC passing therethrough.

The driver IC is preferably packaged in a Tape Carrier Package (TCP).

A plasma display apparatus according to another aspect of the presentinvention comprises: a plasma display panel; a chassis base having theplasma display panel on one side surface thereof and having a drivingcircuit arranged on another side surface thereof; a driver ICelectrically connecting electrodes of the plasma display panel to thedriving circuit, the driver IC adapted to supply voltage signals to theelectrodes of the plasma display panel in accordance with signals fromthe driving circuit; a heat dissipating plate arranged adjacent to thedriver IC and facing the chassis base to interpose the driver IC betweenthe chassis base and the heat dissipating plate; and a first thermalconduction medium arranged between the heat dissipating plate and thedriver IC and adapted to transfer heat generated by the driver IC to theheat dissipating plate.

The first thermal conduction medium is preferably a thermally conductiveliquid or gel medium.

The first thermal conduction medium is preferably silicone oil or athermal grease.

The first thermal conduction medium preferably has a coefficient ofthermal conductivity of not less than 1.0 W/mK and a viscosity of notless than 100,000 cps.

A high thermally conductive solid member is preferably arranged on aportion of the chassis base opposite the driver IC.

The plasma display apparatus further preferably comprises a secondthermal 11 conduction medium disposed between the solid member and thedriver IC and adapted to transfer heat generated by the driver IC to thehigh thermally conductive solid member.

The second thermal conduction medium is preferably a thermallyconductive liquid or gel medium.

The plasma display apparatus further preferably comprises a thirdthermal conduction medium arranged between the first thermal conductionmedium and the driver IC.

The second thermal conduction medium is preferably a thermallyconductive sheet.

The heat dissipating plate further preferably comprises an accommodatingportion adapted to accommodate the first thermal conduction medium on aside surface thereof opposite the driver IC.

BRIEF DESCRIPTION OF THE DRAWINGS

A more complete appreciation of the invention, and many of the attendantadvantages thereof, will be readily apparent as the same becomes betterunderstood by reference to the following detailed description whenconsidered in conjunction with the accompanying drawings in which likereference symbols indicate the same or similar components, wherein:

FIG. 1 is an exploded perspective view of a plasma display apparatushaving a heat dissipating structure for a driver IC according to a firstembodiment of the present invention;

FIG. 2 is a cross-sectional view taken along the A-A line of FIG. 1;

FIG. 3 is a cross-sectional view of a heat dissipating structure for adriver IC according to the second embodiment of the present invention;

FIG. 4 is a cross-sectional view of a heat dissipating structure for adriver IC according to the third embodiment of the present invention;

FIG. 5 is a cross-sectional view of a heat dissipating structure for adriver IC according to the forth embodiment of the present invention;

FIG. 6 is a cross-sectional view of a heat dissipating structure for adriver IC according to the fifth embodiment of the present invention;

FIG. 7 is a cross-sectional view of a heat dissipating structure for adriver IC according to the sixth embodiment of the present invention;

FIG. 8 is a cross-sectional view of a heat dissipating structure for adriver IC according to the seventh embodiment of the present invention;

FIG. 9 is a cross-sectional view of a heat dissipating structure for adriver IC according to the eighth embodiment of the present invention;

FIG. 10 is a cross-sectional view of a heat dissipating structure for adriver IC according to the ninth embodiment of the present invention.

DETAILED DESCRIPTION OF THE INVENTION

A more complete appreciation of the present invention, and many of theattendant advantages thereof, will be readily apparent as the presentinvention becomes better understood by reference to the followingdetailed description when considered in conjunction with theaccompanying drawings in which like reference symbols indicate the sameor similar components, wherein:

FIG. 1 is an exploded perspective view of a plasma display apparatushaving a heat dissipating structure for a driver IC according to a firstembodiment of the present invention, and FIG. 2 is a cross-sectionalview taken along the A-A line of FIG. 1.

With reference to FIG. 1 and FIG. 2, the plasma display apparatusincludes a plasma display panel 12 (referred to hereinafter simply as a“PDP”), and a chassis base 16. The chassis base 16 is made of Cu, Fe, orthe like, and the PDP 12 is mounted on one side surface thereof and adriving circuit 18 is mounted on the other side surface of the chassisbase 16.

The PDP 12 of the plasma display device is mounted on a chassis base(not shown), with a front cover (not shown) on the outside of the PDP 12and a rear cover (not shown) on the outside of a chassis base.

Electrodes extending from the periphery of the PDP 12 are electricallyconnected to the driving circuit 18 to receive the signals required fordriving the PDP 12.

A driver IC 23 is disposed between the PDP 12 and the driving circuit 18to supply voltage signals to the electrodes in accordance with signalsfrom the driving circuit.

The driver IC 23 is packaged in the form of a TCP 25 so that itelectrically interconnects an FPC 21 and the driving circuit 18, and athe driver IC 23 is mounted over the TCP tape FPC 21. The driver IC 23is arranged opposite to the chassis base 16.

On the outside of the driver IC 23, that is, the outside of the TCP 25,a heat dissipating plate 32 is arranged to support the TCP 25 and to fixit to the chassis base 16. The heat dissipating plate 32 is positionedin parallel with and along the periphery of the chassis base 16.

The heat dissipating plate 32 can be positioned in an integral platelongitudinally along the periphery of the chassis base 16, and aplurality of the heat dissipating plates 32 can be positionedsuccessively along the periphery of the chassis base 16, wherein each ofthe heat dissipating plates 32 respectively corresponds to the driver IC23.

The heat dissipating plate 32 can be provided with a first portion 32 aopposite to the driver IC 23 and a second portion 32 b extendingintegrally from one distal end of the first portion toward theperipheral edge of the PDP 12. Such a heat dissipating plate 32 can bemade of Al, Cu, Fe, or the like in the same manner as the chassis base16.

The heat dissipating plate 32 can be affixed to an extension portion 27of the chassis base 16 by means of a fastening member (not shown), forexample, a screw, or it can be affixed to a high thermally conductivesolid member 127 as discussed below. A thermal conduction medium 41 isdisposed between the first portion 32 a of the heat dissipating plate 32and the driver IC 23 so that it efficiently transfers the heat generatedby the driver IC 23 to the heat dissipating plate 32.

In the plasma display apparatus according to the first embodiment of thepresent invention, the heat dissipating plate 32 is provided with anaccommodating portion 50 for accommodating the driver IC 23 so that thethermal conductive medium 41 can be interposed between the driver IC 23and one side surface of the heat dissipating plate 32 opposite to thedriver IC 23. The thermal conductive medium 41 can also be interposedbetween the accommodating portion of the heat dissipating plate 32 andone side surface of the driver IC 23 opposite to the heat dissipatingplate 32.

In more detail, the accommodating portion 50 is provided with anaccommodating recess 36 formed on one side surface of a first portion 32a, and a projecting portion 38 is formed outwardly from the other sidesurface thereof corresponding to the accommodating recess 36. The widthand height of the projection portion 38 are determined according to thewidth and depth of the accommodating recess 36.

Preferably, the driver IC 23 can be partly accommodated in theaccommodating recess 36 at a predetermined height thereof based on thesurface of FPC 21.

The thermal conduction medium 41 should be in a liquid or gel state atleast at the operating temperature of the PDP 12, and a silicone oil ora thermal grease with a coefficient of thermal conductivity above 1.0W/mK can be used.

Such a thermal conduction medium 41 not only serves to transfer the heatgenerated by the driver IC 23 to the heat dissipating plate 32, but alsoserves to fix the driver IC 23 in place, because the thermal conductionmedium 41 is accommodated in the accommodating recess 36 and the thermalconduction medium 41 remains in a gel state around the driver IC partly23 accommodated in the accommodating recess 36.

Since the driver IC 23 is fitted to fully contact the thermal conductionmedium 41, it doesn't need a compression of the heat dissipating plate32 against the driver IC 23 to be fixed in order to transfer the heat.Also, even if an external impact is applied to the chassis base 16 or ifit is bent, since the driver IC 23 is accommodated in the recess 36 andis fitted to the thermal conduction medium 41 in a gel state, and sincea gap is formed between the FPC 21 and the heat dissipating plate 32,the driver IC 23 is protected from damage.

Since the driver IC 23 is partly accommodating in the recess 36 and theheat dissipating plate 32 is fitted to the chassis base 16 by thefastening member, a predetermined gap is formed between the FPC 21 andthe heat dissipating plate 32. As a result, since the thermal conductionmedium 41 absorbs the direct impact between the FPC 21 and the heatdissipating plate 32 and since the external impact applied to the heatdissipating plate 32 is mitigated, damage, such a fracture of the FPC 21or the like, is effectively prevented.

In accordance with the present invention, the thermal conduction medium41 transfers the heat generated by the driver IC 23 to the heatdissipating plate 32. Since the thermal conduction medium 41 isaccommodated in the recess 36 around the edges of the driver IC 23 aswell as at a top surface thereof, both sides of the accommodating recess36 facing the thermal conduction medium 41 also act as heat dissipatingportions. As a result, the contact area for heat dissipation isincreased when the heat dissipating plate 32 is close contact with thethermal conduction medium 41. Accordingly the coefficient of thermalconductivity of the thermal conduction medium 41 against the driver IC23 is enhanced, thereby reducing the a temperature rise of the driver IC23. Also, since the dissipating plate 32 is provided with the projectionportion 38 on one face thereof, corresponding to the recess 36, the heatdissipating plate 32 can has a larger heat dissipating area to enhanceits thermal dissipating efficiency.

Hereafter, in explaining the second through the ninth embodiments of thepresent invention, the same constitution elements as in the constitutionelements of the first embodiment are used with the same referencenumbers, and a detailed description thereof has been omitted for thesake of brevity.

FIG. 3 is a cross-sectional view of a heat dissipating structure for adriver IC according to the second embodiment of the present invention.

With reference to FIG. 3, unlike the first embodiment, a heatdissipating plate 132 is provided with only a first portion 132 aopposite to the driver IC 23. An accommodating portion 150 is providedwith an accommodating recess 136 formed on the one side surface of thefirst portion 132 a, and a projecting portion 138 formed outwardly fromthe other side surface thereof and corresponding to the accommodatingrecess 136. The width and height of the projection portion 138 isdetermined according to the width and depth of the accommodating recess136.

As a result, since the heat dissipating plate 132 according to thesecond embodiment excludes the second portion 32 b of FIG. 2, the totalsize of the plasma display apparatus and the material used for formingthe heat dissipating plate are reduced, thereby resulting in a morecompact and simplified plasma display apparatus.

FIG. 4 is a cross-sectional view of a heat dissipating structure for adriver IC according to the third embodiment of the present invention.

With reference to FIG. 4, an accommodating recess 250 of a heatdissipating plate 232 has a “

”-shaped cross-section with an interior accommodating portion 236, andthe heat dissipating plate 232 thereof is recessed and is fitted to thechassis base 16 so that it accommodates the thermal conductive medium 41and the entire driver IC 23. Accordingly, the heat generated by thedriver IC is effectively transferred to the heat dissipating plate 232through the thermal conductive medium 41.

FIG. 5 is a cross-sectional view of a heat dissipating structure for adriver IC 23 according to the forth embodiment of the present invention.

With reference to FIG. 5, a heat dissipating plate 332 is constructedsuch that it is provided with an accommodating portion 350 having acavity 336 on the interior thereof so as to surround the entire driverIC 23 and at least one portion of the FPC 21. The cavity 336 containsthe thermal conduction medium 41. The FPC 21 penetrates into theaccommodating portion 350. As a result, since the accommodating portion350 and the thermal conduction medium 41 surrounds the entire driver IC23, the coefficient of thermal conductivity of the thermal conductionmedium 41 against the driver IC 23 is enhanced so that the heatgenerated by the driver IC 23 is effectively transferred to the heatdissipating plate 332 though the thermal conduction medium 41 and isdissipated into the air.

FIG. 6 is a cross-sectional view of a heat dissipating structure for adriver IC according to the fifth embodiment of the present invention.

With reference to FIG. 6, a heat dissipating plate 432 is constructedsuch that it is provided with a first portion 432 a opposite to thedriver IC 23 and a second portion 432 b which extends from one distalend of the first portion 432 a toward the peripheral edge of the PDP 12.The heat dissipating plate 432 has a heat sink structure with aplurality of a heat dissipating fins 439 arranged along the firstportion 432 a.

The thermal conduction medium 41 is arranged in an accommodating recess436 of an accommodating portion 450 formed on the one side surface ofthe heat dissipating plate 432. As a result, the heat transferred to theheat dissipating plate 432 through the thermal conduction medium 41 iscapable of additionally dissipating heat through the heat dissipatingfins 439 projecting from the first portion 432 a other side surface ofthe heat dissipating plate 432 to enhance the temperature dropping heatdissipating effect.

FIG. 7 is a cross-sectional view of a heat dissipating structure for adriver IC according to the sixth embodiment of the present invention.

With reference to FIG. 7, a heat dissipating plate 632 has first portion632 a opposite to the driver IC 23, and a second portion 632 b extendingfrom one distal end of the first portion 632 a toward the peripheraledge of the PDP 12. The heat dissipating plate 632 is affixed to a heatsink 660 having a plurality of a heat dissipating fins 639.

An accommodating portion 650 for containing the driver IC 23 and thethermal conduction medium 41 has an accommodating recess 636 formed onthe one side surface of the first portion 632 a and a projecting portion638 formed outwardly from the other side surface thereof andcorresponding to the accommodating recess 636. The heat sink 660 has aregistering coupling recess 651 arranged to couple with the projectionportion 638 by having a shape corresponding thereto. As a result, sincethe contacting area where the heat dissipating plate 632 contacts withthe heat sink 660 is increased, the heat generated by the driver IC 23is more easily dissipated into the air through the heat sink 660.

As discussed above, although the first through the sixth embodimentshave a structure in which the TCP 25 is positioned on the extendingportion 27 of the chassis base 16 (see FIGS. 2-7), the eighth throughthe tenth embodiments have a structure in which the TCP 25 is positionedon a thermally conductive solid member 127 projected from the chassisbase 16, (see FIGS. 8-10).

FIG. 8 is a cross-sectional view of a heat dissipating structure for adriver IC according to the seventh embodiment of the present invention.

With reference to FIG. 8, a heat dissipating plate 732 has a firstportion 732 a opposite the driver IC 23, and a second portion 732 bextending from one distal end of the first portion toward the peripheraledge of the PDP 12. The thermal conduction medium 41 is defined forconvenience as a first thermal conduction medium 41, which is interposedbetween the driver IC 23 and the first portion 732 a of the heatdissipating plate 732. A second thermal conduction medium 42 in a liquidor gel state is further interposed between the driver IC 23 and the highthermally conductive solid member 127.

In more detail, the thermal conduction medium 41 should be in a liquidor gel state at least at the operation temperature of the PDP 12, andcan be a silicone oil or thermal grease. Such a thermal conductionmedium 41 has a coefficient of thermal conductivity of more than 1.0W/mK so as to not flow into the periphery of the circuit elements whenthe apparatus stands upright. Also, it is preferable that the firstthermal conduction medium 41 has a thickness of 0.2 mm between the firstportion 732 a and the driver IC 23.

A fastening member (not shown) makes the heat dissipating plate 732compress so as to contact the driver IC 23 with a predetermined pressuredetermined by the fastening force. With the above heat dissipatingstructure, the heat generated by the driver IC 23 is transferred throughthe first thermal conduction medium 41 to the heat dissipating plate 732and is continuously dissipated into the air.

In addition, the second thermal conduction medium 42 has the samecharacteristics as that of the first conduction medium 41. Accordingly,the heat generated at the driver IC 23 is transferred through the secondthermal conduction medium 42 to the high thermally conductive solidmember 127. Then, the heat transferred to the high thermally conductivesolid member 127 is conducted to the chassis base 16 and is continuouslydissipated into the air.

In the plasma display apparatus according to the embodiment discussedabove, the heat dissipating plate 732 is fitted to the high thermallyconductive solid member 127 while compressing the driver IC 23 with apredetermined pressure. Then, the driver IC 23 is brought into closecontact with the high thermally conductive solid member 127. Since thefirst thermal conductive medium 41 is interposed between the heatdissipating plate 732 and the driver IC 23, the first thermal medium 41is in close contacted against the heat dissipating plate 732 and thedriver IC 23. That is to say, an air layer is not formed on the boundarysurface between the first thermal conduction medium 41 and the heatdissipating plate 732 and or between the first thermal conduction medium41 and the driver IC 23.

In a comparative embodiment, a thermal conduction medium composed ofsheet-type silicone was disposed between the heat dissipating plate 732and the driver IC 23. When the heat dissipating characteristic of thecomparative embodiment was compared to that of the present embodiment, atemperature difference between the heat transferred to the heatdissipating plate 732 and that generated by the driver IC was found. Thetemperature of the driver IC 23 applying the present invention wasmeasured to be 2˜3° C. less than that of the driver IC 23 applying thecomparative embodiment. This shows that the heat dissipatingcharacteristic of the driver IC 23 according to the present embodimentis superior to that of the driver IC 23 according to the comparativeembodiment.

In addition, since the second thermal conduction medium 42 disposedbetween the driver IC 23 and the high thermally conductive solid member127 is formed of a liquid or gel as is the first thermal conductivemedium, the second thermal conductive medium closely contacts the driverIC 23 and the high thermally conductive solid member 127. That is tosay, an air layer is not formed on the boundary surface between thesecond thermal conduction medium 42 and the high thermally conductivesolid member 127 or between the second thermal conduction medium 42 andthe driver IC 23.

Therefore, the contact area between the heat dissipating plate 732 andthe driver IC 23 is increased, thereby enhancing the coefficient ofthermal conductivity from the driver IC 23 to the heat dissipating plate732. Also, the contact area between the driver IC 23 and the highthermally conductive solid member 127 is increased, thereby enhancingthe coefficient of thermal conductivity from the driver IC 23 to thehigh thermally conductive solid member 127.

FIG. 9 is a cross-sectional view of a heat dissipating structure for adriver IC 23 according to the eighth embodiment of the presentinvention.

With reference to FIG. 9, a plasma display apparatus according to theeighth embodiment of the present invention has a structure in which athird thermal conduction medium 43 in the form of a sheet is interposedbetween the driver IC 23 and the first thermal conduction medium 41.

In this embodiment, the third thermal conduction medium 43 is disposedbetween the driver IC 23 and a first portion 832 a of a heat dissipatingplate 832, and the first thermal conduction medium 41 is disposedbetween the first portion 832 a of the heat dissipating plate 832 andthe thermal conduction medium 41. The heat dissipating plate 832 canalso have a second portion 832 b extending from one distal end of thefirst portion 832 a toward the peripheral edge of the PDP 12 andintersecting with the first portion 832 a so as to support the secondportion 832 b.

The third thermal conduction medium 43 can be formed of a silicone sheetaffixed to one side of the driver IC 23 opposite the heat dissipatingplate 832.

In this embodiment, since the first thermal conduction medium 41disposed between the third thermal conduction medium 43 and the heatdissipating plate 832 is a liquid or gel, the first thermal conductivemedium 41 is capable of more closely contacting the third thermalconduction medium 43 and the heat dissipating plate 832. That is to say,an air layer is not be formed on the boundary surface between the firstthermal conduction medium 41 and the heat dissipating plate 832 orbetween the first and third thermal conduction medium 41 and 43.

Therefore, the contact area where the third thermal conduction medium 43is in close contact with the first thermal conduction medium 41 isincreased, thereby enhancing the coefficient of thermal conductivityfrom the driver IC 23 to the heat dissipating plate 832. Also, thecontact area between the driver IC 23 and the high thermally conductivesolid member 127 is increased, thereby enhancing the coefficient ofthermal conductivity from the driver IC 23 to the high thermallyconductive solid member 127.

That is to say, when the heat dissipating plate 832 is compressed towardthe chassis base 16, the heat generated by the driver IC 23 is firstlytransferred to the third thermal conduction medium 43 and thentransferred to the first thermal conduction medium 41, thereby allowingthe heat to be dissipated into the air by the heat dissipating plate832. As a result, the temperature of the driver IC 23 is effectivelyreduced.

FIG. 10 is a cross-sectional view of a heat dissipating structure for adriver IC according to the ninth embodiment of the present invention.

With reference to FIG. 10, a plasma display apparatus according to theninth embodiment of the present invention has an accommodating portion950 for containing the first thermal conduction medium 41 on one sidesurface of a heat dissipating plate 932 opposite the driver IC 23.

The accommodating portion 950 is recessed into the heat dissipatingplate 932 and is capable of accommodating the driver IC 23 and the firstthermal conduction medium 41 of a liquid or gel in the recess.

As described above, with the plasma display apparatus according to thisembodiment of the present invention, since the thermal conduction medium41 contained in the recess of the accommodating recess portion 950 ofthe heat dissipating plate 932 surrounds the sides of the driver IC 23,the side surface of the recess can also act as a heat dissipating plateagainst the thermal conduction medium 41. Accordingly, the contact areawhere the heat dissipating plate 932 is in close contact with thethermal conduction medium 41 is increased, and the coefficient ofthermal conductivity of the thermal conduction medium 41 to the driverIC is enhanced, thereby reducing the temperature increase of the driverIC 23.

Also, since the dissipating plate is provided with the projectionportion on one face thereof corresponding to the recess, the heatdissipating plate can has a larger heat dissipating area to enhance thethermal dissipating efficiency of the driver IC 23.

Since the thermal conduction medium 41 is a liquid or gel at least atthe operating temperature of the PDP 12, an air layer is not formed onthe boundary surface between the thermal conduction medium 41 and theheat dissipating plate 932 or between the thermal conduction medium 41and the driver IC 23, thereby enhancing the heat dissipating efficiencyof the driver IC.

Also, since the thermal conduction medium 41 in a liquid or gel statecan be jellied after injecting it into the accommodating portion 950,the thermal conduction medium 41 does not flow it into the periphery ofthe circuit element when the apparatus is upright, thereby protectingthe circuit from contamination.

Although exemplary embodiments of the present invention have beendescribed in detail above, it should be clearly understood that manyvariations and/or modifications of the basic inventive concept taughtherein will be apparent to those skilled in the art and will still fallwithin the spirit and scope of the present invention, as recited in theappended claims.

1. A plasma display apparatus comprising: a plasma display panel; achassis base arranged parallel to the plasma display panel; a driver ICelectrically connecting electrodes of the plasma display panel to adriving circuit, the driver IC adapted to supply voltage signals to theelectrodes of the plasma display panel in accordance with signals fromthe driving circuit; and a heat dissipating plate arranged adjacent tothe driver IC and facing the chassis base to interpose the driver ICbetween the chassis base and a heat dissipating plate; wherein the heatdissipating plate includes an accommodating portion adapted toaccommodate the driver IC on a side surface thereof opposite to thedriver IC.
 2. The plasma display apparatus of claim 1, wherein theaccommodating portion comprises a thermal conduction medium.
 3. Theplasma display apparatus of claim 1, wherein a thermal conduction mediumis interposed between the driver IC and a side surface of the heatdissipating plate opposite thereto.
 4. The plasma display apparatus ofclaim 2, wherein the thermal conduction medium is interposed between theaccommodating portion of the heat dissipating plate and a side surfaceof the driver IC opposite thereto.
 5. The plasma display apparatus ofclaim 2, wherein the accommodating portion of the thermal conductionmedium is filled with a thermally conductive liquid or gel medium. 6.The plasma display apparatus of claim 2, wherein the thermal conductionmedium is a silicone oil or a thermal grease.
 7. The plasma displayapparatus of claim 1, wherein the accommodating portion includes anaccommodating recess concavely formed on a side surface of the heatdissipating plate.
 8. The plasma display apparatus of claim 1, whereinthe accommodating portion includes a projecting portion formed onanother side surface thereof and corresponding to the accommodatingrecess.
 9. The plasma display apparatus of claim 1, wherein a pluralityof heat dissipating fins are arranged integrally on another side surfaceof the heat dissipating plate.
 10. The plasma display apparatus of claim1, wherein a heat sink is mounted on another side surface of the heatdissipating plate, the heat sink having a plurality of heat dissipatingfins.
 11. The plasma display apparatus of claim 1, wherein the heatdissipating plate comprises: a first portion arranged in parallel withthe chassis base so as to be opposed to the driver IC; and a secondportion extending integrally from one distal end of the first portiontoward a peripheral edge of the plasma display panel.
 12. The plasmadisplay apparatus of claim 1, wherein the driver IC is electricallyconnected to electrodes of the plasma display panel via a FlexiblePrinted Circuit (FPC) and is wholly surrounded by the accommodatingportion and wherein the accommodating portion is penetrated by the FPCpassing therethrough.
 13. The plasma display apparatus of claim 1,wherein the driver IC is packaged in a Tape Carrier Package (TCP).
 14. Aplasma display apparatus comprising: a plasma display panel; a chassisbase having the plasma display panel on one side surface thereof andhaving a driving circuit arranged on another side surface thereof; adriver IC electrically connecting electrodes of the plasma display panelto the driving circuit, the driver IC adapted to supply voltage signalsto the electrodes of the plasma display panel in accordance with signalsfrom the driving circuit; a heat dissipating plate arranged adjacent tothe driver IC and facing the chassis base to interpose the driver ICbetween the chassis base and the heat dissipating plate; and a firstthermal conduction medium arranged between the heat dissipating plateand the driver IC and adapted to transfer heat generated by the driverIC to the heat dissipating plate.
 15. The plasma display apparatus ofclaim 14, wherein the first thermal conduction medium is a thermallyconductive liquid or gel medium.
 16. The plasma display apparatus ofclaim 14, wherein the first thermal conduction medium is silicone oil ora thermal grease.
 17. The plasma display apparatus of claim 14, whereinthe first thermal conduction medium has a coefficient of thermalconductivity of not less than 1.0 W/mK and a viscosity of not less than100,000 cps.
 18. The plasma display apparatus of claim 14, wherein ahigh thermally conductive solid member is arranged on a portion of thechassis base opposite the driver IC.
 19. The plasma display apparatus ofclaim 18, further comprising a second thermal conduction medium disposedbetween the solid member and the driver IC and adapted to transfer heatgenerated by the driver IC to the high thermally conductive solidmember.
 20. The plasma display apparatus of claim 19, wherein the secondthermal conduction medium is a thermally conductive liquid or gelmedium.
 21. The plasma display apparatus of claim 19, further comprisinga third thermal conduction medium arranged between the first thermalconduction medium and the driver IC.
 22. The plasma display apparatus ofclaim 21, wherein the second thermal conduction medium is a thermallyconductive sheet.
 23. The plasma display apparatus of claim 19, whereinthe heat dissipating plate further comprises an accommodating portionadapted to accommodate the first thermal conduction medium on a sidesurface thereof opposite the driver IC.